Glass Core Substrates Roadmap

A comprehensive technical roadmap from organic substrates to Glass Core Substrates, silicon interposer integration, Co-Packaged Optics, and the physics of reliable scaling.

Send me the White Paper

Send me the White Paper

Get the full technical roadmap and analysis. The PDF will be emailed to you immediately after submission.

About the Author

Joe Harden is an independent expert with over 30 years in semiconductor manufacturing. He brings deep experience in yield engineering, process integration, and advanced packaging. He is the inventor of the Harden Criticality Index (HCI) framework and recently filed a non-provisional patent application on physics-based predictive reliability modeling for glass core substrates.

How I Work With Organizations

I help teams navigate the glass core substrate transition through:

Strategic roadmapping and architecture evaluation
Technical diligence on GCS and CPO programs
Advisory on reliability modeling and yield risk reduction

For serious inquiries, please reach out directly or visit waferforge.com.

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